Web回流焊接 是指利用焊膏（由 焊料 和 助焊劑 混合而成的混合物）將一或多個電子元件連接到接觸墊上之後，透過控制加溫來熔化焊料以達到永久接合，可以用 回焊爐 、 紅外加熱燈 … Web11. apr 2024 · Electromigration-induced a remarkable IMC expansion because of unusual stoichiometric transition of (Pd,Ni)Sn 4. • The (Pd,Ni)Sn 4 stoichiometric transition of can be rationalized by the Pd-Ni-Sn thermodynamic equilibrium. • Massive IMC propagation seriously deteriorated the mechanical/electrical reliability of advanced electronic devices. •
The size effect on intermetallic microstructure evolution of critical ...
WebIntermetallic Compound Reflow - SMTnet Web28. aug 2024 · The intermetallic compounds (IMC), Cu 6 Sn 5 and Cu 3 Sn, formed at the interface between the Sn-based solder and Cu during reflow process are vital to the … continuing professional education cpe program
SMT回流焊的温度曲线(Reflow Profile)解说与注意事项 - 知乎
Web9. apr 2024 · IMC thickness is a critical indicator for determining the reliability of solder pads. Typically, the IMC thickness at the interface between the solder layer and the LED chip increases with aging time. Different amounts of Ag-MWCNT addition resulted in different IMC thicknesses. Web31. júl 2024 · The IMC is the region where the copper pad and solder combine to form Cu 3 Sn or Cu 6 Sn 5. It is the most brittle region of the solder joint, which is why it is the area … WebFrom the study, it was found that reflowing under nitrogen atmosphere had better effect on IMC formation and growth compared to reflowing under air. Besides, the cooling rate of … continuing professional education accountants